(Advanced Processes and Design of Microfabrication Techniques)
Spring Semester 2002
Department of Chemical Engineering - University of Illinois at Chicago
Introduction to Microelectronics Processing, Yield
Overview of Electronic Materials
Crystal Growth (4 Lectures)
Fundamentals of Crystal Growth Processes
Energy and Mass Transfer, Modeling
Doping, Design of Crystal Growth Processes
Modeling and Simulation, Examples
Thin Film Deposition (14 Lectures)
Chemical Vapor Deposition (CVD)
Silicon Epitaxy, Thermodynamics
ThermoEMP as a Simulation Tool
(Thermodynamics of Electronic Materials Processing)
A Priori Process - Property Relationships
Surface and Gas Phase Chemical Kinetics
Kinetics and Mass Transfer of Epitaxial Growth
Transport Phenomena, Reactor Design, Modeling
Silicon Germanium, Silicon Carbide
Metal Organic CVD (MOCVD)
Doping of Epilayers, Autodoping, Diffusion
Three-Dimensional Integration
A Priori Process - Property Relationships, Reactor
Analysis and Design, Selective Epitaxial Growth
Three-Dimensional Integration and Microfabrication, Examples
Epitaxial Evaluation, Thin Film Characterization
Physical Vapor Deposition, Molecular Beam Epitaxy
Plasma - Assisted/Enhanced CVD (PACVD or PECVD)
Design of Plasma CVD Reactors, Modeling, Examples
CVD of Polysilicon, Amorphous Silicon, SiO2 and Si3N4
Passivation of Electronic Materials (4 Lectures)
Thermal Oxidation of Silicon
Kinetics, Reactor Design, Modeling
TSUPREM-4 as a Simulation Tool
Oxynitridation of Silicon
Kinetics, Reactor Design, Modeling, Simulation, Examples
Degradation and Characterization of Dielectric Thin Films
Redistribution of Impurities during Thermal Oxidation
Ion Implantation (3 Lectures)
Fundamentals, Kinetics
Design and Process Considerations
Analysis and Design of Masking Films for Ion Implantation
Mathematical Modeling, Examples
Advanced Lithography (5 Lectures)
Chemistry and Physics of Lithographic Materials
Fundamentals of Surface Preparation
Positive and Negative Resists, Multi-Level Resists
Design and Control of Lithographic Materials
Advanced Lift-off Techniques, Problem Areas, Examples
Dry Etching (4 Lectures)
Low-Pressure Discharges, Physical and Chemical Phenomena
Selectivity - Feature and Pattern Size Control
Fundamentals of Dry Etching
Design and Process Considerations
Modeling - Simulation, Examples
Wet Etching (2 Lectures)
Chemistry - Physics, Thermodynamic and Kinetic Considerations
Analysis and Design of Wet Etching Processes
Characterization of Etched Substrate Surfaces, Modeling - Examples
Design of Experiments (2 Lectures)
How to Use Statistical Techniques, General Factorial Design
Factorial Design at Two Levels, Interaction Effects, Example
Analysis of Data, Minimum Significant Factor and Curvature Effects
Example
From:
Sze, S.M., VLSI Technology, McGraw-Hill, 1988.
Wolf, S., and Tauber, R.N., Silicon Processing for the VLSI Era. V. 1 - Process Technology, Lattice Press, 1986.
Middleman S., and A.K. Hochberg, Process Engineering Analysis in Semiconductor Device Fabrication, McGraw Hill, 1993.
-----------------------------------------------------------------------------------------------------------------------------------------------------------------------
Lee, H.H., Fundamentals of Microelectronics Processing, McGraw-Hill, 1990.
Ghandi, S.K., VLSI Fabrication Principles, Wiley Interscience, 1983.
Runyan W.R. and K.E. Bean, Semiconductor Integrated Circuit Processing Technology, Addison Wesley 1990.
Ruska, S.W., Microelectronic Processing, McGraw Hill, 1987.
Kovacs, T.A., Micromachined Transducers Sourcebook, McGraw-Hill, 1998.
Sze, S.M., Semiconductor Devices - Physics and Technology, Wiley, 1985
Levy, R.A., Microelectronic Materials and Processes, Kluwer, 1989.
Also: Handouts and relevant journal articles will be used.