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Research Facility
Bonder



Specifications: This thermosonic gold wire bonder is a precision machine. Its special features include vertical feeding of wire,Wire Bonder manual (x,y) control of the work piece and manual control of the bond tool.

This bonder is a Model 522A, manufactured by Hybond, Inc.

Contact: Dr. Renganathan Ashokan, ashokan@uic.edu.


Facilities

Laboratory Equipment List:


Materials Growth

 Opus 45 MBE system
 MBE Cluster Tool system
 Riber-32 MBE system
 Riber-EPI MBE system

Materials Characterization

 Scanning Electron Microscope
 Hall measurement system
 Ellipsometry System
 The Auger System
 Vacuum Electro-Reflectance
 Photoluminescence
 Other Equipments

Device

 Device Fabrication
 Mask Aligner
 Photoresist Spinner
 Evaporation Systems
 Bonder
 I-V, C-V Setup
 Spectral Response

© 2000
Microphysics Laboratory
University of Illinois at Chicago