The plasma and metallization chamber
Metal and/or insulating materials can be deposited in the Ultra-High
Vacuum (UHV) plasma metallization
chamber using thermal evaporation and/or an electron gun.
The plasma can also be used
to oxidize the surface or to selectively etch certain areas of the sample.
The plasma metallization chamber combines RF
etching, E-beam sputtering and high-temperature evaporating of metals.
Currently, a carbon source is connected to this chamber to do research
on diamond and diamond-like films.
Interconnection of the chambers
The growth and analytical chambers are interconnected through UHV
transfer modules.
This enables the study of interface properties--such as possible valence
band offset and ohmic contacts--as well as the study of a freshly
deposited uncontaminated material.
Attachments
Optical characterization tools such as reflection difference (RD) and
spectroscopic ellipsometry are used to perform real-time measurement
and analysis.