NSF Research Experiences for Undergraduates in
“Novel Materials and Processing in Chemical and
Biomedical Engineering”
The Departments of Chemical Engineering,
Bio-Engineering, and Mechanical Engineering at the University of
Illinois at Chicago is pleased to announce its Summer Research
Fellowship Program for 2005. Twelve fellowships are sponsored by the
National Science Foundation (NSF) Research Experiences for
Undergraduates (REU) Program. Summer fellows will have the opportunity
to conduct research in Novel Materials and Processing in chemical and
biomedical engineering in an academic setting. This program welcomes
students in Science and Engineering.
The location of UIC in the heart of Chicago
offers a particularly advantageous situation for engineering and science
students because of the enormous amount of chemical industry and medical
institutions in the Chicago area. UIC is the only public engineering
school in the city. The UIC Engineering Departments have grown rapidly
with highly active faculty members, undergraduates, graduate students,
and postdoctoral fellows. We are located in the east campus of UIC.
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The
projects span a broad range of topics
Emphasis will be placed on using
state-of-the-art experimental and computational facilities. Special
events such as seminars, tutorials, workshops, visits to local
industries, and socials are planned throughout the summer.
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Program Description
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Participants work for a summer at the University of Illinois at
Chicago, collaborating with faculty and staff on current
research projects on novel materials and processing in chemical
and biomedical engineering. |
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Open
to students who are not graduating before December 2005. US
citizenship or permanent residence is required.
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Selection is based on applicant’s academic standing, a brief
statement of interest, and a faculty reference.
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Women
and minorities are especially encouraged to apply. |
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Award
includes: $3,600 stipend, and up to $300 for travel. Financial
assistance of up to $1,100 is available for campus housing; this
should cover the full housing expense. |
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The
program ends on August 5, 2005; the preferred starting date is
May 31, 2005. |
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