NSF Research Experiences for Undergraduates in

“Novel Advanced Materials and Processing in Biomedical, Electrical and Chemical Engineering”

sponsored by:
the National Science Foundation (NSF-REU) and the Department of Defense (DoD-ASSURE)

The Departments of Chemical Engineering, Bio-Engineering, and Mechanical Engineering at the University of Illinois at Chicago are pleased to announce their Summer Research Fellowship Program for 2008. Thirteern fellowships are sponsored by the National Science Foundation (NSF) Research Experiences for Undergraduates (REU) and the Department of Defense (DoD) ASSURE (Awards to Stimulate and Support Undergraduate Research Experiences) programs. Summer fellows will have the opportunity to conduct research in Novel Materials and Processing in chemical and biomedical engineering in an academic setting. This program welcomes students in Science and Engineering.

The location of UIC in the heart of Chicago offers a particularly advantageous situation for engineering and science students because of the enormous amount of chemical industry and medical institutions in the Chicago area. UIC is the only public engineering school in the city. The UIC Engineering Departments have grown rapidly with highly active faculty members, undergraduates, graduate students, and postdoctoral fellows. We are located in the east campus of UIC.

The projects span a broad range of topics

	Atomic layer deposition of novel multifunctional nanostructures
	Neural Interface Engineering and Analysis
	Broad Dissemination of BioMEMS Devices
	Nanotube-Based Nanofluidic Devices and Fundamental Fluid Studies at the Nanoscale
	Plasma-Assisted Synthesis of Nanolayer Catalysts
	Hydrogen Storage Materials based on Boron
	Atomic scale characterization of functional oxide materials
	Ultra-low thermal conductivity insulation
	Molecular Beam Epitaxy Growth of Multiferroic Oxides for Tunable Memory Devices

Emphasis will be placed on using state-of-the-art experimental and computational facilities. Special events such as seminars, tutorials, workshops, visits to local industries, and socials are planned throughout the summer.

Program Description

	Participants work for a summer at the University of Illinois at Chicago, collaborating with faculty and staff on current research projects on novel advanced materials and processing with applications in biomedical, electrical and chemical engineering.
	Open to students who are not graduating before December 2008. US citizenship or permanent residence is required.
	Selection is based on applicant’s academic standing, a brief statement of interest, and two faculty references.
	Women and minorities are especially encouraged to apply.
	Award includes: $3,800 stipend, and up to $400 for travel. Financial assistance of up to $1,250 is available for campus housing; this should cover the full housing expense.
	The program ends on August 1, 2008 the preferred starting date is May 27, 2008.