NSF Research Experiences for Undergraduates in

“Novel Materials and Processing in Chemical and Biomedical Engineering”

The Departments of Chemical Engineering, Bio-Engineering, and Mechanical Engineering at the University of Illinois at Chicago is pleased to announce its Summer Research Fellowship Program for 2010. Eleven fellowships are sponsored by the National Science Foundation (NSF) Research Experiences for Undergraduates (REU) Program. Summer fellows will have the opportunity to conduct research in Novel Materials and Processing in chemical and biomedical engineering in an academic setting. This program welcomes students in Science and Engineering.

The location of UIC in the heart of Chicago offers a particularly advantageous situation for engineering and science students because of the enormous amount of chemical industry and medical institutions in the Chicago area. UIC is the only public engineering school in the city. The UIC Engineering Departments have grown rapidly with highly active faculty members, undergraduates, graduate students, and postdoctoral fellows. We are located in the east campus of UIC.

The projects span a broad range of topics

	Atomic layer deposition of TiO2 on Silicon and Copper Substrates: Investigation of the Initial Growth
	Modeling and Designing of a Drift-free Biocompatible Pressure Sensor for use in Long Term In-Vivo Testing
	ßII L2079P Mutational Effect on Spectrin (aß)2 Tetramer Formation
	Comprehensive JP8 mechanism for vituated flows
	Hydrodynamics of Drop Impact and Spray Cooling through Nanofiber Mats
	Solvent Selection and Recycling for Carbon Absorption in a Pulverized Coal Power Plant
	Temperature-Dependent Electrical Characterization of Multiferroic BFO Thin Films
	Microfluidic Bandage for Localized Oxygen-Enhanced Wound Healing
	Localized and automated chemical and oxygen delivery system for microfluidic brain slice devices
	TEM Study of Rhodium Catalysts with Manganese Promoter
	Method for Characterizing Icephobicity of Hydrophobic Coatings

Emphasis will be placed on using state-of-the-art experimental and computational facilities. Special events such as seminars, tutorials, workshops, visits to local industries, and socials are planned throughout the summer.

Program Description

	Participants work for a summer at the University of Illinois at Chicago, collaborating with faculty and staff on current research projects on novel advanced materials and processing with applications in biomedical, electrical and chemical engineering.
	Open to students who are not graduating before December 2010. US citizenship or permanent residence is required.
	Selection is based on applicant's academic standing, a brief statement of interest, and two faculty references.
	Women and minorities are especially encouraged to apply.
	Award includes: $3,800 stipend, and up to $400 for travel. Financial assistance of up to $1,250 is available for campus housing; this should cover the full housing expense.
	The program ends on August 5, 2010 the preferred starting date is June 1, 2010.